Slip damage of silicon wafers subjected to continuous infrared laser irradiation
http://www.sciencedirect.com/science/article/pii/S1567173914001072
Volume 14, Issue 6, June 2014, Pages 843–849
Slip damage of silicon wafers subjected to continuous infrared laser irradiation
Highlights
- •
We investigate the laser irradiance inducing slip damage in a silicon wafer.
- •
We develop a simulation model to predict the slip damage.
- •
The model calculates the resolved shear stress and the temperature.
- •
The slipping irradiance predicted by simulation agrees well with the experiments.
Abstract
Laser irradiation can cause damage to solids, such as slipping, cracking, melting, and ablation. Silicon crystals are brittle, so slipping is a serious problem because it can easily result in fracture. This study investigates the amount of continuous near-infrared (NIR) laser irradiance that induces slip damage in a single-crystal silicon wafer. For this purpose we developed a simulation model based on heat transfer and thermo-elastic analyses. To verify the simulation model, silicon wafer specimens were irradiated by a fiber laser beam (of wavelength 1065 nm), and the surface morphology after laser beam irradiation was inspected using optical microscopy (OM). The irradiation time was fixed at 10 s, and nine different irradiances from 180 W/cm2 to 380 W/cm2 were tested in steps of 25 W/cm2. No slip surface was found after exposure to the irradiances up to 230 W/cm2, but straight slips in the <110> direction appeared at the irradiances of 255 W/cm2 and above. These experimental findings agreed well with the simulation.
Keywords
- Infrared laser;
- Silicon wafer;
- Thermal stress;
- Slip damage
-
Influence of slit width on harmonic generation in ultrasonic surface waves excited by masking a laser beam with a line arrayed slit
-
Evaluation of Ultrasonic Nonlinear Characteristics in Heat-Treated Aluminum Alloy
-
Initial Second Harmonic Generation in Narrowband Surface Waves by Multi-Line Laser Beams for Two Kinds of Spatial Energy Profile
-
Feasibility of MFC (Macro-Fiber Composite) Transducers for Guided Wave Technique
-
Imaging of contact acoustic nonlinearity using synthetic aperture technique
-
Thermal Damage Characterization of Silicon Wafer Subjected to CW Laser Beam
-
Application of Macrofiber Composite for Smart Transducer of Lamb Wave Inspection
-
Evaluation of Ultrasonic Nonlinear Characteristics in Heat-Treated Aluminum Alloy (Al-Mg-Si-Cu)
-
Crack Detection in Single-Crystalline Silicon Wafer Using Laser Generated Lamb Wave
-
A6061 합금의 석출경화 열처리에 따른 탄성파의 음향 특성 연구
-
Evaluation of Ultrasonic Nonlinear Characteristics in Heat-Treated Aluminum Alloy
-
Initial Second Harmonic Generation in Narrowband Surface Waves by Multi-Line Laser Beams for Two Kinds of Spatial Energy Profile Models
-
Feasibility of MFC (Macro-Fiber Composite) Transducers for Guided Wave Technique
-
Thermal damages on the surface of a silicon wafer induced by a near-infrared laser
-
Slip damage of silicon wafers subjected to continuous infrared laser irradiation
-
Simulations for Internal Defect Inspection using Laser Generated Ultrasonic Wave in Ablation Regime
-
Evaluation of Ultrasonic Nonlinear Characteristics in Artificially Aged Al6061-T6
-
Initiation time of near-infrared laser-induced slip on the surface of silicon wafers
-
In situ detection of laser-induced slip initiation on the silicon wafer surface
-
In-Line Ultrasonic Monitoring for Sediments Stuck on Inner Wall of a Polyvinyl Chloride Pipe